Tiny USB 3.0 Hub

Open source, tiny (~penny-sized) USB 3.2 Gen 1x1 hub for distributed sensing applications.


Documentation: https://docs.google.com/document/d/1O4f5b7Dc3Jj556MIkbM53eZpJiqbKlDK-BqDew--iZo/edit?usp=sharing



Description

  • A tiny (penny-sized) 4-port USB 3.2 Gen 1x1 hub designed for distributed sensing networks.

  • Supports USB 3.0 and USB 2.0, with 5 Gbps SuperSpeed bandwidth using the TI TUSB8041.

  • Features individual port power control, ESD protection, and can operate as bus-powered or with external power.

  • Built on a 4-layer PCB (27.5 × 36.5 mm) optimized for signal integrity, heat dissipation, and high-speed differential pair routing.

  • Designed for integration into size- and weight-constrained systems such as whole-body sensing networks on free-space vine robots.

  • Fully open-source, with schematics, PCB, and test scripts available.

Learning Outcomes

1. Technical Skills & Knowledge

  • High-speed PCB design: USB 3.0 impedance matching, intra-/inter-pair skew, signal integrity

  • Development using TI TUSB8041 and debugging using the official TUSB8041EVM dev board

  • Power distribution, current handling, and protection circuitry (OC, ESD)

  • Thermal analysis, voltage rail diagnostics, and bring-up troubleshooting

  • Prototyping and testing with multiple USB cameras and scripted tools (e.g., OpenCV)

2. General Project/Practical Skills

  • Systems Engineering: High-frequency electronics design, testing, and iteration under tight space constraints

  • Failure analysis and debugging: Hardware bring-up with thermal and electrical diagnostics

  • Documentation and collaboration: Detailed technical documentation, lab notes, and presentation of results

  • Open-source hardware development: BOM optimization, manufacturability for small-scale assembly (e.g., JLCPCB)

Open source, tiny (~penny-sized) USB 3.2 Gen 1x1 hub for distributed sensing applications

Open source, tiny USB 3.2 Gen 1x1 hub designed for distributed sensing applications, featuring 4 ports, individual power control, and ESD protection. It supports USB 3.0 with 5 Gbps bandwidth and is optimized for integration into compact systems. Key learning outcomes include high-speed PCB design, systems engineering, failure analysis, and open-source hardware development.